Question 3.38.E: A 0.03-in-thick copper plate (k = 223 Btu/h · ft · °F) is sa...

A 0.03-in-thick copper plate (k=223  Btu / h \cdot ft \cdot{ }^{\circ} F) is sandwiched between two 0.1-in.-thick epoxy boards (k = 0.15  Btu / h \cdot ft \cdot{ }^{\circ} F) that are 7 \text { in. } \times 9 \text { in. } in size. Determine the effective thermal conductivity of the board along its 9-in.-long side. What fraction of the heat conducted along that side is conducted through copper?

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A thin copper plate is sandwiched between two layers of epoxy boards. The effective thermal conductivity of the board along its 9 in long side and the fraction of the heat conducted through copper along that side are to be determined.

Assumptions 1 Steady operating conditions exist. 2 Heat transfer is one-dimensional since heat transfer from the side surfaces are disregarded 3 Thermal conductivities are constant.

Properties The thermal conductivities are given to be k=223 Btu / h \cdot ft \cdot{ }^{\circ} F for copper and 0.15 Btu / h \cdot ft \cdot{ }^{\circ} F for epoxy layers.

Analysis We take the length in the direction of heat transfer to be L and the width of the board to be w. Then heat conduction along this two-layer plate can be expressed as (we treat the two layers of epoxy as a single layer that is twice as thick)

\dot{Q}=\dot{Q}_{\text {copper }}+\dot{Q}_{\text {epoxy }}=\left(k A \frac{\Delta T}{L}\right)_{\text {copper }}+\left(k A \frac{\Delta T}{L}\right)_{\text {epoxy }}=\left[(k t)_{\text {copper }}+(k t)_{\text {epoxy }}\right] w \frac{\Delta T}{L}

 

Heat conduction along an “equivalent” plate of thick ness t=t_{\text {copper }}+t_{\text {epoxy }} and thermal conductivity k_{\text {eff }} can be expressed as

\dot{Q}=\left(k A \frac{\Delta T}{L}\right)_{\text {board }}=k_{\text {eff }}\left(t_{\text {copper }}+t_{\text {epoxy }}\right) w \frac{\Delta T}{L}

 

Setting the two relations above equal to each other and solving for the effective conductivity gives

k_{\text {eff }}\left(t_{\text {copper }}+t_{\text {epoxy }}\right)=(k t)_{\text {copper }}+(k t)_{\text {epoxy }} \longrightarrow k_{\text {eff }}=\frac{(k t)_{\text {copper }}+(k t)_{\text {epoxy }}}{t_{\text {copper }}+t_{\text {epoxy }}}

 

Note that heat conduction is proportional to kt. Substituting, the fraction of heat conducted along the copper layer and the effective thermal conductivity of the plate are determined to be

(k t)_{\text {copper }}=\left(223  Btu / h \cdot ft \cdot{ }^{\circ} F \right)(0.03 / 12  ft )=0.5575  Btu / h \cdot{ }^{\circ} F

 

(k t)_{\text {epoxy }}=2\left(0.15  Btu / h \cdot ft \cdot { }^{\circ} F \right)(0.1 / 12  ft )=0.0025  Btu / h \cdot{ }^{\circ} F

 

(k t)_{\text {total }}=(k t)_{\text {copper }}+(k t)_{\text {epoxy }}=(0.5575+0.0025)=0.56  Btu / h \cdot{ }^{\circ} F

 

and

k_{e f f}=\frac{(k t)_{\text {copper }}+(k t)_{\text {epoxy }}}{t_{\text {copper }}+t_{\text {epoxy }}}

 

                                    =\frac{0.56  Btu / h \cdot{ }^{\circ} F }{[(0.03 / 12)+2(0.1 / 12)]  ft }=29.2  Btu / h \cdot ft ^{2} \cdot{ }^{\circ} F

 

f_{\text {copper }}=\frac{(k t)_{\text {copper }}}{(k t)_{\text {total }}}=\frac{0.5575}{0.56} = 0.996 = 99.6 \%
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