Question 9.5: CMOS Well-Depth Design An n-well CMOS process is designed f...
CMOS Well-Depth Design
An n-well CMOS process is designed for circuit operation at V_{DD} = 1.5 V. The starting wafers are p-type with N_a = 5 × 10^{14} cm^{-3} . The n-wells are to have an average dopant density N_d = 3 × 10^{15} cm^{-3} . The p-channel MOSFET sources and drains are to have junction depths x_j = 0.8 μm and an average dopant density N_a = 10^{18} cm^{-3} . What is the minimum n-well depth that will avoid vertical punchthrough to the substrate?
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