Question 9.2: Subthreshold Current An n-channel MOSFET process is to be b...

Subthreshold Current

An n-channel MOSFET process is to be built in a p-type region doped with 8 × 10^{16}  cm^{-3} , acceptors using an n^+ polysilicon gate. The oxide thickness is 15 nm, and the gate length is 0.8 μm. What is the ratio of the leakage currcnt that flows at V_G = V_T to that at V_G = 0 ?

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For an n^+ polysilicon gate, n-channel MOSFET doped with N_a = 8 \times 10^{16} acceptors cm^{-3} the flat-band voltage and \phi_p are estimated from Table 8.1 and the discussion in Sec. 8.3 to be -0.9 V and 0.36 V, respectively.

TABLE 8.1 Work Functions ( \pmb{\Phi _M} and \pmb{\Phi _S} )and Flat-Band Voltages for Commonly Used Gate Materials and p-Type Silicon with \pmb{N_a=1.1 \times 10^{15} \ cm^{-3}}  .

Gate  material
parameter
Aluminum \pmb{n^+} polysilicon \pmb{p^+} polysilicon Tungsten
Φ_M (V) 4.1 4.05 5.17 4.61
Φ_S (V) 4.9 4.9 4.9 4.9
V_{FB} (V) -0.8 -0.85 0.27 -0.29

The gate-oxide capacitance C_{ox} is 2.3 \times 10^{-7} F cm^{-2} , and the threshold voltage is calculated to be 0.41 V from Equation 8.3.18.

V_T=V_{FB}+V_C+2\left|\phi _p\right| +\frac{1}{C_{ox}} \sqrt{2\epsilon _sqN_a(2\left|\phi _p\right|+V_C-V_B )}                                             (8.3.18)

We calculate x_{dmax} = 1.28 \times 10^{-5} cm = 0.128 μm from Equation 8.3.6, and therefore C_d = 8.2 \times 10^{-8} F \ cm^{-2} .

x_{dmax}=\sqrt{\frac{4\epsilon _s\left|\phi _p\right| }{qN_a} }                                            (8.3.6)

From Equation 9.1.29, n = 1.36, and S = 82 mV/decade.

n=1+\frac{C_d}{C_{ox}}                                            (9.1.29)

For a threshold voltage of 0.41 V, the current is (0.41/0.082) decades lower at V_G = 0 than at V_T . That is, the current at V_G = V_T is 10^5 times that at V_G = 0 .

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